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Five-Day Semiconductor Specialization Bootcamp

Course Information

  • Sessions 5 days
  • Duration 37.5 hrs
  • Level Beginner
  • Assessment NA

Venue

Kuala Lumpur: G-3A-02, Suite Pejabat Korporat, KL Gateway, No 2, Jalan kerinchi, Gerbang kernichi Lestari, 59200 Kuala Lumpur, Malaysia
Penang: Jalan Sungai Dua, 11700 Penang, Malaysia.

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Certification

  • Certificate of Completion from Tertiary Courses - Upon meeting at least 75% attendance and passing the assessment(s), participants will receive a Certificate of Completion from Tertiary Courses.

Five-Day Semiconductor Specialization Bootcamp

Course Code: C746
  • HRDF

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What's This Course About

This Five-Day Semiconductor Specialization Bootcamp is designed for professionals eager to deepen their understanding of CMOS process modules, semiconductor device physics, and advanced IC packaging technologies. Participants will learn about key semiconductor processes such as photolithography, ion implantation, and chemical mechanical polishing (CMP), along with a comprehensive overview of CMOS process flows and performance optimization techniques.

The course also delves into the physics behind semiconductor devices like PN junctions, MOS capacitors, and MOSFETs, as well as cutting-edge trends like Chiplet technology, FINFET, GAAFET, and 3D packaging solutions. Ideal for engineers and industry professionals, this bootcamp will equip you with the skills to thrive in the evolving semiconductor landscape.

WSQ Funding

Full Fee 4,500.00 Before GST
GST 405.00 9% of fee
Baseline Nett 2,655.00 SG/PR age 21+ · 50% funded
MCES / SME Nett 1,755.00 SG age 40+ · 70% funded
Funding and Grant Applications

No funding is available for this course

Course Fee

MYR4,500.00

Additional Note

Please bring your own laptop for hands-on training. If you don't have laptop, we can provide spare laptop for training use.

Disclaimer: The course dates displayed on our website are tentative and subject to trainer availability. We will confirm the final date after checking with the trainer. You are also welcome to email us your preferred date at sales@tertiarycourses.com.my, and we will do our best to coordinate with the trainer's schedule.

Post-Course Support

  • We may provide consultation related to the subject matter after the course.
  • Please email your queries to sales@tertiarycourses.com.my and we will forward your queries to the subject matter experts and get back to you as soon as possible.

Cancellation & Reschedule Policy

  • We reserve the right to cancel or re-schedule the course due to unforeseen circumstances. If the course is cancelled, we will refund 100% to participants.
  • Note: the venue of the training is subject to changes due to class size and availability of the classroom. The minimum class size to start a class is 3 Pax.

Course Details

Course Details

What You'll Learn

Topic 1 CMOS Process Modules and Process Flow

CMOS process modules

Photolithography and Mask

Etch

Clean

Ion Implantation

Diffusion and RTP

Film

CMP

CMOS process flows

Topic 2 Semiconductor Device Phyics

PN Junction

MOS Capacitor

MOSFET

BJT

Memory Devices

Topic 3: CMOS Process Integration and Performance 

CMOS process integration and sort yield

CMOS device and reliability performances

Statistical process control

Overview of future IC technologies – Chiplet, FINFET and GAAFET

Topic 3: Packaging

Wire Bonding

Flip Chip and Surface Mount Technologies

3D Stacking and Through Silicon Via (TSV) Packaing

Topic 4: Future Trend in IC Technlogies

Chiplet Technology

FINFET and GAAFET

Silicon Photonics

Non-Silicon Technologies

Course Info

Prerequisite

This is a intermediate level course. The following prerequisite is assumed

Software Requirement

Please download and install the following software prior to the class

Job Roles

Job Roles

  • Semiconductor Process Engineer
  • CMOS Integration Engineer
  • Semiconductor Device Physicist
  • Process Development Engineer
  • Packaging Engineer
  • Photolithography Engineer
  • Wafer Fabrication Specialist
  • Etching Process Engineer
  • Semiconductor Yield Engineer
  • Reliability Engineer
  • Process Control Engineer
  • Test Engineer
  • Ion Implantation Engineer
  • CMP Process Engineer
  • Semiconductor Packaging Engineer
  • IC Design Engineer
  • Flip Chip Packaging Specialist
  • 3D Packaging Engineer
  • Chiplet Integration Engineer
  • Semiconductor Research Scientist

Trainers

Trainers

Saeid is co-founder of Skymics Sdn Bhd. He has 8 years of experience in the field of IoT (Internet of Things) and Information Technology. He is a certified IBM IoT Practitioner and instructor, and a Certified Citizen Data Scientist Train-The-Trainer. He has been co-inventor of 3 inventions during the last 4 years.

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